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Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing
ISBN: 978-0-470-82780-2
May 2011
576 pages
Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource.
Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging