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From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications

ISBN: 978-1-118-88147-7

September 2021

256 pages

Description
FROM LED TO SOLID STATE LIGHTING

A comprehensive and practical reference complete with hands-on exercises and experimental data

In From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications, accomplished mechanical engineers Shi-Wei Ricky Lee, Jeffery C. C. Lo, Mian Tao, and Huaiyu Ye deliver a practical overview of the design and construction of LED lighting modules, from the fabrication of the LED chip to the LED modules incorporated in complete LED lighting fixtures. The distinguished authors discuss the major advantages of solid-state lighting, including energy savings, environmental friendliness, and lengthy operational life, as well as the contributions offered by the packaging of light-emitting diodes in the pursuit of these features.

Readers will discover presentations of the technical issues that arise in packaging LED components, like interconnection, phosphor deposition, and encapsulation. They’ll also find insightful elaborations on optical design, analysis, and characterization. Discussions of LED applications, technology roadmaps, and IP issues round out the included material.

This important book also includes:

  • Thorough introductions to lighting, photometry, and colorimetry, the fundamentals of light-emitting diodes, and the fabrication of LED wafers and chips
  • Practical discussions of the packaging of LED chips, wafer-level packaging of LED arrays, and optical and electrical characterization
  • Comprehensive explorations of board-level assembly and LED modules and optical and electrical characterization
  • In-depth examinations of thermal management, reliability engineering for LED packaging, and applications for general lighting

Perfect for post-graduate students and practicing engineers studying or working in the field of LED manufacturing for solid state lighting applications, From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications is also an indispensable resource for managers and technicians seeking a one-stop guide to the subject.

About the Author

Shi-Wei Ricky Lee, Professor of Mechanical Engineering, Director of Center for Advanced Microsystems Packaging (CAMP) at the Hong Kong University of Science & Technolog; and Director of HKUST LED-FPD Technology R&D Center at Foshan, China. Ricky Lee received his PhD degree from Purdue University, USA. His research activities cover wafer level packaging and 3D IC integration, LED packaging for solid state lighting, lead-free soldering and reliability analysis. Ricky has substantial publications in international journals/conference proceedings and has received several best paper awards. He is the recipient of IEEE CPMT Electronics Manufacturing Technology Award, ASME EPPD Excellence in Mechanics Award, and IMAPS John A. Wagnon Technical Achievement Award. Ricky served as Editor-in-Chief of IEEE Transactions on Components & Packaging Technologies and Associate Editor of ASME Journal of Electronic Packaging. Ricky is the project leader for the implementation of HB-LED Solid State Lighting on Hong Kong subway trains.

Jeffery C. C. Lo, Program Manager, Center for Advanced Microsystems Packaging, Clear Water Bay, Kowloon, Hong Kong.  Dr. Lo received his PhD degree in Mechanical Engineering from the Hong Kong University of Science & Technology (HKUST) in 2008. He is currently the program manager of Electronic Packaging Laboratory (EPACK Lab) under CAMP. His duties at EPACK Lab include technical training and laboratory management. He specializes in flip chip technology, chip scale packages, and MEMS packaging. He won the Best Poster Paper Award of IEEE Electronic Components & Technology Conference (ECTC2004) and Young Award of IEEE 9th VLSI Packaging Workshop (VPWJ2008) in Japan.